Equipment Name: Large-Scale Optical Component Ultrasonic Cleaning Equipment
Model: TC-3.0
Technical Specifications:
- Fully automatic operation mode
- Precise temperature control of cleaning solution (±1.0℃)
- Multi-frequency ultrasonic cleaning: 40KHz to 270KHz
- 7-tank multifunctional integration: Solution cleaning - deionized water rinsing - deionized water rinsing again - hot air drying
- Maximum substrate size (Length x Width x Thickness): <700mm x 600mm x 70mm
- High cleanliness cleaning for functional substrates
Applications:
(1) Semiconductor Industry: Cleaning of single-crystal silicon substrates.
(2) Optical Field: High-cleanliness cleaning of optical substrates of various sizes.
