Equipment Name: Large-Scale Optical Component Ultrasonic Cleaning Equipment

Model: TC-3.0

Technical Specifications:

- Fully automatic operation mode

- Precise temperature control of cleaning solution (±1.0℃)

- Multi-frequency ultrasonic cleaning: 40KHz to 270KHz

- 7-tank multifunctional integration: Solution cleaning - deionized water rinsing - deionized water rinsing again - hot air drying

- Maximum substrate size (Length x Width x Thickness): <700mm x 600mm x 70mm

- High cleanliness cleaning for functional substrates

Applications:

(1) Semiconductor Industry: Cleaning of single-crystal silicon substrates.

(2) Optical Field: High-cleanliness cleaning of optical substrates of various sizes.